芯片开封技术laser decap

芯片开封技术laser decap
半导体业的铜制程芯片越来越成为发展主流，这给失效分析中器件开封带来越来越高的挑战。传统的酸开封已经没有办法完成铜制程器件的开封，良率一般低于30%。此时仪准科技推出的激光开封机，给分析产业带来了新的技术。
产品特点：
1、对铜制程器件有很好的开封效果，良率**90%。
2、对环境及人体污染伤害交小，符合环保理念。
3、开封效率是普通酸开封机台的3~5倍。
4、电脑控制开封形状、位置、大小、时间等，操作便利。
5、设备稳定，故障率远低于酸开封机台。
6、几乎没有耗材，running cost很低。
7、体积较小，*摆放。

TooDescription: 
1.Software: Windows XP
2.Good Solution for the Depcasulation Processing
3.The Best Solution of Copper Bonding MateriaOpening.
4.The Etch Rate Is Controllable and the Good Etch Uniformity.
5.Convenient Failure Analysis Toofor PCBA or BGA Substrate Sample Preparation.

Applied Package Types:
QFP, QFN, SOT
TO, DIP
BGA
COB, Assembly types
Short Processing Time in ASIC and Power Chip
MCM Sample Opening
Customized Area Opening


The TotaSolution of Stacked Chip Opening.
The Copper Wire Bonding Decapsulation.
Adjusted Etch Rate to Controthe Decapsulated Well.The Package 2nd Bonding Inspection with Laser Decapsulation.
 
The PCB or BGA substrate Delayer Inspection.
Failure Analysis for the Copper Crack or ElectricaProbing.

The Sample Preparation for Molding Compound Removaand Cross-section.
The Specific Shape Opening Is Available.